Four months after its release in China, the Leica-branded Xiaomi 15 flagship has finally hit the global market.

Apple's iPhone 16e isn't as affordable as the previous iPhone SE series, but it does come with some pretty promising specs ...

A complete RF Transceiver (IP/die) for adding Bluetooth Low Energy v5.2 (2.4GHz) capability to any SoC with embedded MCU via a standard SPI interface. Integrated BLE Link Layer enables data ...

What is certain is that the fourth member of the S25 family also uses a Qualcomm Snapdragon 8 Elite as its SoC, which presents the manufacturer with the tricky task of providing the hot-headed ...

An integrated SoC would solve that problem ... as it seeks to move away from Qualcomm's component currently used in iPhones. Apple's transition away from Qualcomm modems is a logical step ...

flagship-grade hardware and a thin and light design. According to OPPO, it features the largest inner screen among book-style foldable smartphones. Despite its slim profile, the device houses a 5 ...

A 1-inch sensor sits in the middle under protective glass and can be used to take photos if a suitable ... the periscope telephoto camera. The SoC is a Qualcomm Snapdragon 7s Gen3.

interfacing with a logic die and PHY, which then connects to a GPU, CPU, TPU, or SoC die. The entire stack sits on an interposer atop a package substrate, similar to the packaging design used in HBM.

Unveiled at Embedded World 2025, Thundercomm’s TurboX C6690 is a SoM (System-on-Module) powered by a 4nm Qualcomm Dragonwing QCS6690 octa-core SoC, and designed for Android 15-based terminal equipment ...